828-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Description
28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C

RoHS Compliant

828-AG11D Datasheet

In Stock: 525

Can ship immediately

QTY UNIT PRICE
1:$8.11000
17:$7.76741
34:$7.09199

Product Specifications

TypeDescription
Series:800
Package:Tube
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:80.0µin (2.03µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 105°C

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