XR2C-2011-N

Omron Electronics Components

CONN SOCKET SIP 20POS GOLD

Description
20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C

RoHS Compliant

XR2C-2011-N Datasheet

In Stock: 220

Can ship immediately

QTY UNIT PRICE
1:$2.81000
10:$2.69667
25:$2.47187

Product Specifications

TypeDescription
Series:XR2
Package:Bulk
Part Status:Active
Type:SIP
Number of Positions or Pins (Grid):20 (1 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature:-55°C ~ 125°C

You May Interested

110-93-628-41-801000
110-93-628-41-801000
CONN IC DIP SOCKET 28POS GOLD
3-1571550-0
3-1571550-0
CONN IC DIP SOCKET 32POS GOLD
D2840-42
D2840-42
CONN IC DIP SOCKET 40POS GOLD
264-5205-01
264-5205-01
CONN SOCKET QFN 64POS GOLD
SA183040
SA183040
CONN IC DIP SOCKET 18POS GOLD
AR 24-HZW/TN
AR 24-HZW/TN
CONN IC DIP SOCKET 24POS GOLD
08-4513-10
08-4513-10
CONN IC DIP SOCKET 8POS GOLD
2-1571551-9
2-1571551-9
CONN IC DIP SOCKET 28POS GOLD
117-43-642-41-005000
117-43-642-41-005000
CONN IC DIP SOCKET 42POS GOLD
211-1-40-006
211-1-40-006
CONN IC DIP SOCKET 40POS GOLD
110-47-628-41-605000
110-47-628-41-605000
CONN IC DIP SOCKET 28POS GOLD
299-43-310-11-001000
299-43-310-11-001000
CONN IC DIP SOCKET 10POS GOLD
Top