2-382467-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Description
28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -

RoHS Compliant

2-382467-1 Datasheet

In Stock: 120

Can ship immediately

Call for price or sumbit a RFQ

Product Specifications

TypeDescription
Series:Diplomate DL
Package:Tube
Part Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Beryllium Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature:-

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