TDU02DXTB

Sullins Connector Solutions

TEST SOCKET

Description
2 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder 0.150" (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 150°C

RoHS Compliant

TDU02DXTB Datasheet

In Stock: 158

Can ship immediately

Call for price or sumbit a RFQ

Product Specifications

TypeDescription
Series:-
Package:Bulk
Part Status:Active
Type:Axial
Number of Positions or Pins (Grid):2 (Rectangular)
Pitch - Mating:-
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Board Guide
Termination:Solder
Pitch - Post:0.150" (3.81mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS)
Operating Temperature:-65°C ~ 150°C

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