MS03

Apex Microtechnology

CONN TRANSIST TO-3 8POS GOLD

Description
8 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Polyester, Glass Filled -

RoHS Compliant

MS03 Datasheet

In Stock: 121

Can ship immediately

Call for price or sumbit a RFQ

Product Specifications

TypeDescription
Series:Apex Precision Power®
Package:Bulk
Part Status:Discontinued at Digi-Key
Type:Transistor, TO-3
Number of Positions or Pins (Grid):8 (Oval)
Pitch - Mating:-
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:-
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyester, Glass Filled
Operating Temperature:-

You May Interested

100-016-051
100-016-051
CONN IC DIP SOCKET 16POS GOLD
SIP050-1X03-160BLF
SIP050-1X03-160BLF
CONN SOCKET SIP 3POS GOLD
8058-1G34
8058-1G34
CONN TRANSIST TO-5 10POS GOLD
1-1825093-4
1-1825093-4
CONN IC DIP SOCKET 16POS GOLD
110-33-422-41-530000
110-33-422-41-530000
CONN IC SKT DBL
1571586-6
1571586-6
CONN IC DIP SOCKET 20POS TIN
2-1437542-7
2-1437542-7
CONN IC DIP SOCKET 20POS GOLD
820-AG12D
820-AG12D
CONN IC DIP SOCKET 20POS GOLD
APA-318-G-D
APA-318-G-D
ADAPTER PLUG
1-1814655-3
1-1814655-3
CONN SOCKET SIP 20POS GOLD
2-641932-4
2-641932-4
CONN IC DIP SOCKET 24POS GOLD
1814642-1
1814642-1
CONN IC DIP SOCKET 4POS GOLD
Top