SIP050-1X28-157BLF

Storage & Server IO (Amphenol ICC)

CONN SOCKET SIP 28POS TIN

Description
28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -

RoHS Compliant

SIP050-1X28-157BLF Datasheet

In Stock: 139

Can ship immediately

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Product Specifications

TypeDescription
Series:SIP050-1x
Package:Bulk
Part Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):28 (1 x 28)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-

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