MMF006630

VPG Micro-Measurements

1240-FPA SILVER SOLDER PASTE --

Description
Ag40Cu30Zn28Ni2 (40/30/28/2) - 1220 ~ 1435°F (660 ~ 780°C) - - Lead Free Jar, 1 oz (28g) 9 Months Date of Manufacture 41°F ~ 77°F (5°C ~ 25°C)

RoHS Compliant

MMF006630 Datasheet

In Stock: 139

Can ship immediately

QTY UNIT PRICE
1:$170.20000

Product Specifications

TypeDescription
Series:-
Package:Jar
Part Status:Active
Type:Solder Paste
Composition:Ag40Cu30Zn28Ni2 (40/30/28/2)
Diameter:-
Melting Point:1220 ~ 1435°F (660 ~ 780°C)
Flux Type:-
Wire Gauge:-
Process:Lead Free
Form:Jar, 1 oz (28g)
Shelf Life:9 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:41°F ~ 77°F (5°C ~ 25°C)

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