DS34S132GNA2+

Maxim Integrated

IC TELECOM INTERFACE 676TEPBGA

Description
TDMoP 1 1.8V, 3.3V - - -40°C ~ 85°C Surface Mount 676-BGA 676-TEPBGA (27x27)

RoHS Compliant

DS34S132GNA2+ Datasheet

In Stock: 1,012

Can ship immediately

Call for price or sumbit a RFQ

Product Specifications

TypeDescription
Series:-
Package:Tray
Part Status:Active
Function:TDM-over-Packet (TDMoP)
Interface:TDMoP
Number of Circuits:1
Voltage - Supply:1.8V, 3.3V
Current - Supply:-
Power (Watts):-
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:676-BGA
Supplier Device Package:676-TEPBGA (27x27)

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