DIP300T600P18

Chip Quik, Inc.

DIP-18 (0.3" BODY) TO DIP-18 (0.

Description
- 18 0.100" (2.54mm) 0.063" (1.60mm) FR4 Epoxy Glass 0.900" L x 0.700" W (22.86mm x 17.78mm)

RoHS Compliant

DIP300T600P18 Datasheet

In Stock: 197

Can ship immediately

QTY UNIT PRICE
1:$3.69000

Product Specifications

TypeDescription
Series:Proto-Advantage
Package:Bulk
Part Status:Active
Proto Board Type:DIP to DIP
Package Accepted:-
Number of Positions:18
Pitch:0.100" (2.54mm)
Board Thickness:0.063" (1.60mm)
Material:FR4 Epoxy Glass
Size / Dimension:0.900" L x 0.700" W (22.86mm x 17.78mm)

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