DILB18P-223TLF

Storage & Server IO (Amphenol ICC)

CONN IC DIP SOCKET 18POS TINLEAD

Description
18 (2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C

RoHS Compliant

DILB18P-223TLF Datasheet

In Stock: 6,254

Can ship immediately

QTY UNIT PRICE
1:$0.35000
10:$0.33410
26:$0.28596

Product Specifications

TypeDescription
Series:DILB
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin-Lead
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:100.0µin (2.54µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyamide (PA), Nylon
Operating Temperature:-55°C ~ 125°C

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