808-AG11D-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Description
8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C

RoHS Compliant

808-AG11D-LF Datasheet

In Stock: 3,856

Can ship immediately

QTY UNIT PRICE
1:$1.65000
10:$1.49678
25:$1.40572

Product Specifications

TypeDescription
Series:800
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 105°C

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