DILB8P-223TLF

Storage & Server IO (Amphenol ICC)

CONN IC DIP SOCKET 8POS TIN

Description
8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C

RoHS Compliant

DILB8P-223TLF Datasheet

In Stock: 16,880

Can ship immediately

QTY UNIT PRICE
1:$0.16000
10:$0.14800
25:$0.11008

Product Specifications

TypeDescription
Series:-
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:100.0µin (2.54µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyamide (PA), Nylon
Operating Temperature:-55°C ~ 105°C

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