508-AG11D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Description
8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C

RoHS Compliant

508-AG11D-ES Datasheet

In Stock: 2,191

Can ship immediately

QTY UNIT PRICE
1:$1.86000
10:$1.68640
25:$1.58307

Product Specifications

TypeDescription
Series:500
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:-
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 105°C

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