211-1-08-003

CnC Tech

CONN IC DIP SOCKET 8POS GOLD

Description
8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C

RoHS Compliant

211-1-08-003 Datasheet

In Stock: 6,744

Can ship immediately

QTY UNIT PRICE
1:$0.78000
10:$0.72621
25:$0.65359

Product Specifications

TypeDescription
Series:-
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polybutylene Terephthalate (PBT)
Operating Temperature:-55°C ~ 105°C

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