524-AG10D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Description
24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C

RoHS Compliant

524-AG10D-ES Datasheet

In Stock: 511

Can ship immediately

QTY UNIT PRICE
1:$6.82000
20:$6.53963
40:$5.97113

Product Specifications

TypeDescription
Series:500
Package:Bulk
Part Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:-
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:-
Operating Temperature:-55°C ~ 125°C

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