2-1571550-9

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Description
28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C

RoHS Compliant

2-1571550-9 Datasheet

In Stock: 393

Can ship immediately

QTY UNIT PRICE
1:$8.82000
17:$8.43575
34:$7.66909

Product Specifications

TypeDescription
Series:500
Package:Tube
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C

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