208-7391-55-1902

3M

CONN SOCKET SOIC 8POS GOLD

Description
8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C

RoHS Compliant

208-7391-55-1902 Datasheet

In Stock: 676

Can ship immediately

QTY UNIT PRICE
1:$27.53000
10:$24.85400
25:$23.81188

Product Specifications

TypeDescription
Series:Textool™
Package:Bulk
Part Status:Active
Type:SOIC
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:-
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:-
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyethersulfone (PES), Glass Filled
Operating Temperature:-55°C ~ 150°C

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