115-93-640-41-001000

Mill-Max

CONN IC DIP SOCKET 40POS GOLD

Description
40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C

RoHS Compliant

115-93-640-41-001000 Datasheet

In Stock: 256

Can ship immediately

QTY UNIT PRICE
1:$4.21000
10:$4.03602
30:$3.70021

Product Specifications

TypeDescription
Series:115
Package:Tube
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):40 (2 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass Alloy
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C

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