NC191SNL15

Chip Quik, Inc.

SMOOTH FLOW LEAD-FREE SOLDER PAS

Description
Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)

RoHS Compliant

NC191SNL15 Datasheet

In Stock: 181

Can ship immediately

QTY UNIT PRICE
1:$12.95000

Product Specifications

TypeDescription
Series:Smooth Flow™
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:422 ~ 428°F (217 ~ 220°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Syringe, 0.53 oz (15g), 5cc
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 46°F (3°C ~ 8°C)

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