WS991SNL500T4

Chip Quik, Inc.

SOLDER PASTE THERMALLY STABLE WS

Description
Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) Water Soluble - Leaded Jar, 17.64 oz (500g) 6 Months Date of Manufacture -

RoHS Compliant

WS991SNL500T4 Datasheet

In Stock: 247

Can ship immediately

QTY UNIT PRICE
1:$96.13000

Product Specifications

TypeDescription
Series:CHIPQUIK®
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423°F (217°C)
Flux Type:Water Soluble
Wire Gauge:-
Process:Leaded
Form:Jar, 17.64 oz (500g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:-

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