BDN09-3CB

CTS Corporation

HEATSINK CPU .91" SQ

Description
Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.910" (23.11mm) 0.910" (23.11mm) - 0.355" (9.02mm) - 9.60°C/W @ 400 LFM 26.90°C/W Aluminum Black Anodized

RoHS Compliant

BDN09-3CB Datasheet

In Stock: 1,699

Can ship immediately

QTY UNIT PRICE
1:$1.80000
10:$1.71187
25:$1.66724

Product Specifications

TypeDescription
Series:BDN
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Not Included)
Shape:Square, Pin Fins
Length:0.910" (23.11mm)
Width:0.910" (23.11mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:9.60°C/W @ 400 LFM
Thermal Resistance @ Natural:26.90°C/W
Material:Aluminum
Material Finish:Black Anodized

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